ESD: Lead-Free Soldering: Rework

Course Code: SLR

Delivery: LAN, On-line


A modular interactive multimedia learning program for rework operators and supervisors responsible for the rework of lead-free electronic assemblies.


Participants successfully completing the course are able to identify and explain:

  • Concepts of rework and lead-free rework.
  • Areas of rework affected by transition to lead-free.
  • Defects more likely to occur with lead-free assembly.
  • Appearance of acceptable tin/lead and lead-free joints.
  • Care of soldering equipment and demands of lead-free.
  • Solder types based on labelling and naming conventions.
  • Role of flux and the impact of lead-free.
  • Impact of lead-free on board laminates and finishes.
  • Maintaining a mixed tin/lead and lead-free facility.
  • Removal, cleaning, and replacement for through-hole, SMT.
  • Cleaning procedures after reworking lead-free.
  • Moisture control in lead-free rework.
  • Challenges in reworking SMT area-array devices.
  • Optical and X-ray Inspection for area-array devices.
  • Temperature issues for area-array devices with lead-free.

Qualification and Certification Testing

LearnTech® training incorporates interactive learning checks throughout the instructional sequences. Certification tests are criterion-referenced and module-based with feedback on every response for enhanced learning. The tests also include a scorebar to provide the learner with continuous status information. Administrative access to dates and scores of tests, certifications, and re-certifications is compliant with ISO quality-standards requirements.

Standard Compliant

This course applies JEDEC Standard JESD97 for Identification of Lead(Pb) Free Assemblies, Components, and Devices.

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