ESD: Lead-Free Soldering: Rework


Course Code: SLR

Delivery: LAN, On-line

Audience

A modular interactive multimedia learning program for rework operators and supervisors responsible for the rework of lead-free electronic assemblies.


Objectives

Participants successfully completing the course are able to identify and explain:

  • Concepts of rework and lead-free rework.
  • Areas of rework affected by transition to lead-free.
  • Defects more likely to occur with lead-free assembly.
  • Appearance of acceptable tin/lead and lead-free joints.
  • Care of soldering equipment and demands of lead-free.
  • Solder types based on labelling and naming conventions.
  • Role of flux and the impact of lead-free.
  • Impact of lead-free on board laminates and finishes.
  • Maintaining a mixed tin/lead and lead-free facility.
  • Removal, cleaning, and replacement for through-hole, SMT.
  • Cleaning procedures after reworking lead-free.
  • Moisture control in lead-free rework.
  • Challenges in reworking SMT area-array devices.
  • Optical and X-ray Inspection for area-array devices.
  • Temperature issues for area-array devices with lead-free.

Qualification and Certification Testing

LearnTech® training incorporates interactive learning checks throughout the instructional sequences. Certification tests are criterion-referenced and module-based with feedback on every response for enhanced learning. The tests also include a scorebar to provide the learner with continuous status information. Administrative access to dates and scores of tests, certifications, and re-certifications is compliant with ISO quality-standards requirements.

Standard Compliant

This course applies JEDEC Standard JESD97 for Identification of Lead(Pb) Free Assemblies, Components, and Devices.

See Industry Testimonials for our training courses!

 

to the top

 

This site is best viewed with Microsoft Internet Explorer (min recommended resolution is 1024x768
© copyright 2006